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Type of bind: Paperback
Dewey Decimal Number: 620
EAN num: 9780521078948
ISBN number: 0521078946
Label: Cambridge University Press
Manufacturer: Cambridge University Press
Quantity: 1
Page Count: 292
Printing Date: September 11, 2008
Publishing house: Cambridge University Press
Sale Popularity Level: 1842270
Studio: Cambridge University Press
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Requiring knowledge of the chemistry and physics of materials, this study relates the complete set of strength characteristics of constituent atoms to their electronic structures. The book uses classical and quantum mechanics (since both are needed to describe these properties) and begins with short reviews of each area. After the reviews, the three major branches of the strength of materials are divided into the following sections: the elastic stiffnesses; the plastic responses; and the nature of fracture.
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Rated by buyers -
Most, if not all Materials Scientists/Engineers engaged in research are familiar with Prof. J. J. Gilman. After all, he is the co-author (with W. G. Johnston) of the classic paper on dislocation dynamics, a requisite building block of dislocation theory. We are also familiar with his work at Allied Chemical Corp. (now Honeywell Corp.), where he led a pioneering R&D effort that took metallic glasses from a laboratory curiosity to a viable technology (currently successfully industrialized in Japan). These two contributions alone would suffice to put him in the pantheon of materials. However, Prof. Gilman's restless and innovative mind has probed into many other areas, and the literature contains a cornucopia of creative contributions, ranging from kinking to dislocation multiplication mechanisms to deformation mechanisms in metallic glasses to detonation mechanisms in explosives. He also coined the term "Inventivity." It is a measure of research efficiency (analogous with productivity), as it applies to viable technologies. This reviewer has also spent a considerable number of hours reading a book entitled Micromechanics of Flow in Solids (McGraw Hill, unfortunately out of print).
It is indeed a pleasant surprise to review the latest creative work of Professor Gilman: Electronic Basis of the Strength of Materials. Descartes, in the 17th century (Discours de la Méthode), separated and emphasized two aspects of research: analysis and synthesis. The second should periodically follow the first, if one is to gain a profound, unified understanding of a field. This book is a remarkable expression of synthesis and represents an impressive accomplishment. It connects bonding with elasticity, plasticity, and fracture of materials. It does this at a level that can be comfortably assimilated by a graduate student, avoiding unnecessary esoteric convolutions of theory and explaining basic facts that are avoided in other textbooks.
The book is well suited for a graduate text and indeed students will gain a new insight into the mechanical response of materials. As Gilman states in the foreword, this book is the very first to relate the complete set of strength characteristics to the electronic structure. This part is completely ignored in continuum mechanics, where the properties are elusive and mysterious parameters that are mathematically operated on. Atoms are not even mentioned. In the conventional mechanical behavior of materials treatments, atoms form the foundation for the mechanisms. Prof. Gilman takes us one step further in the dimensional scale: electrons are the starting point. He uses Heisenberg's Principle and the principle of polarizability as cornerstones of his vision. From there, he obtains bulk and shear moduli (in elastic deformation), and explains key aspects of plastic deformation, strength, and fracture. Throughout the book historical aspects of importance are interjected, helping the reader to understand the flow of ideas and seminal developments.
We welcome this significant addition to the materials library and applaud Prof. Gilman for his erudite and helpful contribution.
Rated by buyers -
One of the big "interdisciplinary" subjects in science and technology yesterday is using atomic-scale simulations and high-end characterization techniques to determine the electronic structure of materials, and understanding reactions at surfaces and between molecules. Such research is especially prevalent in the (bio)chemical, pharmaceutical and semiconductor industries where the drive is to know how electrons move between adjacent atoms to form/break bonds, and carry current.
One topic that often gets shorted in terms of publications of both journals and books is how the electronic structure of a material can be used to understand its mechanical properties. This is unfortunate, especially considering that mechanical properties are often easier to measure, calculate, visualize and understand than electrical, optical, or magnetic properties. This book addresses this deficiency, and for this I give it one star.
The book begins with introductions to quantum mechanics and deformation mechanics that undergraduates in science or engineering can understand. From there, the book shows how the electronic configuration of different atoms can be used to deduce the type of solids they will form, and their mechanical properties such as bulk and shear modulus. The different types of intermolecular and intramolecular bonding are also discussed, and how each is attributable to different electron configurations.
The overall level of the book is appropriate for upper-division undergraduates in physics, chemistry, materials or mechanical engineering. All equations are accompanied by at least one paragraph of explanation, and the reader is never lead on complex derivations from one equation to another. Models to illustrate theories are always explained in conceptual terms first, then in mathematical terms if space allows. Therefore, this is the easiest electronic structure book to understand and follow mathematically. Also, most major models for use in simulating solids are covered. These include empirical models such as the Morse potential, Lennard-Jones potential, etc., and the models that account for electrons: HOMO-LUMO, VSEPR, free-electron, etc... I give this book a second star for addressing bonding from so many different viewpoints, and a third star for keeping the math simple and readable.
A fourth star goes to this book for its the simplified use of group theory. Many books on electronic and atomic structure introduce group theory, and then incorporate it via matrices in the rest of the text. This is appropriate for a complete understanding, but can be quite challenging to follow. This book takes an alternate course; for many concepts it simplifies the true 3-D picture to 1-D or 2-D thereby simplifying the symmetry considerations.
I give this book its fifth star for its simple, yet elegant pictures, tables, and graphs. I illustrate with two examples. First example is the comparison of moduli values for different materials. The book does this with 3-D plots that show how the moduli changes with one trend (e.g. ionicity in bonding) versus it changing with another trend (e.g. atomic weight). Beautiful! The second example are the pictures showing the different types of plastic deformation at the atomic-scale: edge vs shear dislocation, twinning versus gliding, etc... Excellent. Dr. Gilman, if you are reading this review, I suggest you show your pictures to the UK people who write the MATTER software. They should use some of your pictures.
I highly recommend this book to anyone who uses computer simulations or experimental techniques to examine the physical and mechanical properties of solids at the nanoscale. I also recommend this book to materials scientists in general, and metallurgists in particular.
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